Schlüsselwörter
(Englisch)
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3D semiconductor process simulation
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Alternative Projektnummern
(Englisch)
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EU project number: EP 24.038
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Forschungsprogramme
(Englisch)
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EU-programme: 4. Frame Research Programme - 1.3 Telematic systems
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Kurzbeschreibung
(Englisch)
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See abstract
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Weitere Hinweise und Angaben
(Englisch)
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Full name of research-institution/enterprise:
ISE Integrated Systems Engineering AG
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Partner und Internationale Organisationen
(Englisch)
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FhG IIS-B, Erlangen (D), FhG ISiT, Itzehohe (D), SGS Thomson, Crolles (F), Austria Microsystems (AMS), Unterpremstätten (A), ISEN, Lilles (F), Technische Universität Wien (A), ETH Zürich (CH), Sigma-C, München (D), ISE AG, Zürich (Schweiz)
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Abstract
(Englisch)
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Within PROMPT II, a commercial 3D process simulation program system is developed. It is going to be a key part of the next generation of simulation tools to support the development of advanced semiconductor technologies and optimization of deep submicron devices. The project starts from the encouraging results of the project ESPRIT 8150 PROMPT in which a multidimensional process simulation system has been developed which compiles the input for 3D device simulation from the results of existing 1D, 2D and newly developed preliminary 3D process simulation modules. The software system available from PROMPT as the starting point of the PROMPT II project has already been used by expert engineers to provide the required input to 3D device simulation, compiled from 1D and 2D process simulations and preliminary 3D modules. PROMPT is already interfaced to the leading-edge 3D device simulation program DESSIS which has been successfully commercialized by the software house ISE AG. Further more, also commercialization of major parts of the PROMPT system via the software houses ISE AG and SIGMA-C has already started, and is being prepared for the remaining modules.
The major part of the work in PROMPT II deals with the development and improvement of the 3D process simulation modules which are necessary to simulate 3D effects which are becoming crucial for ULSI devices. The activities to be carried out in PRMOPT II include industrial specification, implementation of advanced algorithms for adaptive meshing in case of fixes and time dependent geometries, the development and improvement of 3D process simulation modules of retching, layer deposition, ion implantation, diffusion and oxidation, their integration into the overall PROMPT program system, the implementation of advanced physical models such as used in current 2D simulators, the evaluation of the software in terms of program stability and performance, and the preparation for commercialization.
The industrial objective of the project is to enhance the existing multi-dimensional process simulation from the PROMPT project to provide a robust, efficient and accurate 3D TCAD tool for use by process development engineers in support of advanced CMOS, BICMOS/bipolar, and EPROM technologies. Benchmarks for the functionality, performance and accuracy of the multidimensional process simulation system to be developed are specified by the semiconductor companies and software houses.
The software results of the PROMPT II project are commercialized on a world-wide scale by the software houses ISE AG and SIGMA-C.
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Datenbankreferenzen
(Englisch)
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Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. +41 31 322 74 82
Swiss Project-Number: 96.0278-1
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