Hermetically sealed double conical gold via glass substrate for the MEMS encapsulation and interposer market.

• Unité de recherche: INNOSUISSE
• Numéro de projet: 14795.1;5 PFNM-NM
• Titre du projet anglais: Hermetically sealed double conical gold via glass substrate for the MEMS encapsulation and interposer market.

Description succincte (Anglais)

Hermetically sealed double conical gold via glass substrate for the MEMS encapsulation and interposer market.

Description succincte (Français)

Hermetically sealed double conical gold via glass substrate for the MEMS encapsulation and interposer market.

Résumé des résultats (Abstract) (Anglais)

The project seeks to innovate the production process of hermetically sealed double-conical electrical contacts realised through a glass substrate (so-called TGV, Through Glass Via). The new production process will enable smaller dimensions of the electrical contacts and consequently contribute to further miniaturisation of assembled electronic components such as MEMS (Micro Electro-Mechanical Systems). The new production process steps comprise the development and application of an optimised photoresist composition and the integration of a direct photo patterning system replacing structuring the photoresist with a mask. The improved process steps will be designed to match the requirements of the powder blasting technology applied to create the Via structures.

Résumé des résultats (Abstract) (Français)

The project seeks to innovate the production process of hermetically sealed double-conical electrical contacts realised through a glass substrate (so-called TGV, Through Glass Via). The new production process will enable smaller dimensions of the electrical contacts and consequently contribute to further miniaturisation of assembled electronic components such as MEMS (Micro Electro-Mechanical Systems). The new production process steps comprise the development and application of an optimised photoresist composition and the integration of a direct photo patterning system replacing structuring the photoresist with a mask. The improved process steps will be designed to match the requirements of the powder blasting technology applied to create the Via structures.