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Unité de recherche
INNOSUISSE
Numéro de projet
11548.2;7 PFIW-IW
Titre du projet
Development of industrial gas-metal plasma sources for the deposition of nanostructured GaN semiconductor layers for lighting applications
Titre du projet anglais
Development of industrial gas-metal plasma sources for the deposition of nanostructured GaN semiconductor layers for lighting applications

Textes relatifs à ce projet

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Description succincte
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Résumé des résultats (Abstract)
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Textes saisis


CatégorieTexte
Description succincte
(Allemand)
Development of industrial gas-metal plasma sources for the deposition of nanostructured GaN semiconductor layers for lighting applications
Description succincte
(Anglais)
Development of industrial gas-metal plasma sources for the deposition of nanostructured GaN semiconductor layers for lighting applications
Résumé des résultats (Abstract)
(Allemand)
Epitaxial coating processes using low-energy gas-metal plasmas offer a promising path to the cost-effective manufacturing of highly energy-efficient LEDs for power-saving lighting applications and high-efficient thirdgeneration solar cells. The goal of the project is to move this innovative coating technology a step closer to industrial application and commercial exploitation by (a) developing and optimizing the plasma-processing equipment, (b) better understanding and controlling the fundamentals of the deposition process itself and (c) developing demonstrator devices based on the unique nanostructured GaN layers obtainable with the process.
Résumé des résultats (Abstract)
(Anglais)
Epitaxial coating processes using low-energy gas-metal plasmas offer a promising path to the cost-effective manufacturing of highly energy-efficient LEDs for power-saving lighting applications and high-efficient thirdgeneration solar cells. The goal of the project is to move this innovative coating technology a step closer to industrial application and commercial exploitation by (a) developing and optimizing the plasma-processing equipment, (b) better understanding and controlling the fundamentals of the deposition process itself and (c) developing demonstrator devices based on the unique nanostructured GaN layers obtainable with the process.