Plasma Reflow Technology for Wafer Level Packaging

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Forschungsstelle

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Projektnummer

9117.2;6 PFNM-NM

Projekttitel

Plasma Reflow Technology for Wafer Level Packaging

Projekttitel Englisch

Plasma Reflow Technology for Wafer Level Packaging

Texte zu diesem Projekt

	Deutsch	Französisch	Italienisch	Englisch
Kurzbeschreibung	-	-	-
Abstract	-	-	-

Erfasste Texte

Kategorie	Text
Kurzbeschreibung (Englisch)	Plasma Reflow Technology for Wafer Level Packaging
Abstract (Englisch)	The objective of this project is to develop advanced process and equipment technology for Solder Reflow in Wafer Level Packaging (WLP). For the first time in the industry, dedicated plasma cleaning will be integrated with controlled thermal processing in a single chamber. The in-situ plasma clean removes surface oxides from bump structures in an environmentally benign manner so that the reflow process can be performed without the use of any solder flux. Valuable scientific and technological knowledge of the basic nature of the processes involved in the integrated Plasma Clean and Solder Reflow will be generated in the course of the project. The novel process technology will be made available on a first demonstration chamber. Commercialization of the Plasma Reflow technology in the Semiconductor and Microsystems industry is intended by UCP upon completion of the project.

Kategorie

Text

Kurzbeschreibung
(Englisch)

Plasma Reflow Technology for Wafer Level Packaging

Abstract
(Englisch)

The objective of this project is to develop advanced process and equipment technology for Solder Reflow in Wafer Level Packaging (WLP). For the first time in the industry, dedicated plasma cleaning will be integrated with controlled thermal processing in a single chamber. The in-situ plasma clean removes surface oxides from bump structures in an environmentally benign manner so that the reflow process can be performed without the use of any solder flux. Valuable scientific and technological knowledge of the basic nature of the processes involved in the integrated Plasma Clean and Solder Reflow will be generated in the course of the project. The novel process technology will be made available on a first demonstration chamber. Commercialization of the Plasma Reflow technology in the Semiconductor and Microsystems industry is intended by UCP upon completion of the project.