Microsensors for high-speed bonding of ultra-thin semiconductor chip.

• Research unit: INNOSUISSE
• Project number: 7361.2;6 NMPP-NM

Short description (German)

Microsensors for high-speed bonding of ultra-thin semiconductor chip.

Short description (English)

Microsensors for high-speed bonding of ultra-thin semiconductor chip.

Abstract (German)

The packaging trend in the semiconductor industry is clearly going towards 3-dimensional packaging (stacked thin dice) where the used silicon chips have reached thicknesses in the order of 25-75 micrometer. For successful high speed volume production it is crucial to reach the highest process yield and productivity numbers possible. In this project novel micro sensors will be developed to measure the local forces involved during the peeling process of a chip from a wafer foil and to detect the successful peel process. The sensors will be a crucial part for the implementation of a speed-optimized peel-and-pick process with superior placement accuracy.

Abstract (English)

The packaging trend in the semiconductor industry is clearly going towards 3-dimensional packaging (stacked thin dice) where the used silicon chips have reached thicknesses in the order of 25-75 micrometer. For successful high speed volume production it is crucial to reach the highest process yield and productivity numbers possible. In this project novel micro sensors will be developed to measure the local forces involved during the peeling process of a chip from a wafer foil and to detect the successful peel process. The sensors will be a crucial part for the implementation of a speed-optimized peel-and-pick process with superior placement accuracy.