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Unité de recherche
INNOSUISSE
Numéro de projet
8355.1;3 NMPP-NM
Titre du projet
Development of high throughput plasma processes for Gallium Nitride epitaxy at low substrate temperatures for applications in the field of lighting
Titre du projet anglais
Development of high throughput plasma processes for Gallium Nitride epitaxy at low substrate temperatures for applications in the field of lighting

Textes relatifs à ce projet

 AllemandFrançaisItalienAnglais
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Résumé des résultats (Abstract)
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Textes saisis


CatégorieTexte
Description succincte
(Anglais)
Development of high throughput plasma processes for Gallium Nitride epitaxy at low substrate temperatures for applications in the field of lighting
Résumé des résultats (Abstract)
(Anglais)
A break-through deposition technology for thin film semiconductor deposition will be applied to Gallium Nitride based materials. The technology will allow fabrication of layer stacks suitable for light-emitting diodes (LEDs) at exceptionally high throughput levels and on large area silicon substrates, making it especially suitable for high volume LED fabrication for lighting applications. Deliverables include commissioning of a concept tool designed by the industrial partner, process development and cost-effective fabrication of LED-quality GaN-layers. The project will enable fast commercialization of the technology by Swiss industry and contribute to the latter's competitiveness on an international scale.