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Research unit
INNOSUISSE
Project number
3026.2;1 EUK
Project title
High density Tape Automated Bonding (TAB) interconnections for large chips
Project status Finished
 
Start date 01.08.1995
End date 26.11.1996
 
Granted total costs 78'750.00  CHF
Section 2 EUREKA
Project category Project
Research type Applied research and development
NABS classification Industrial production and technology
 
Research disciplines
100 % Not yet defined
Last modification of the project
27.11.2014