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Research unit
INNOSUISSE
Project number
7730.2;6 NMPP-NM
Project title
Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

Participants

Research organisation: Innosuisse
Swiss Innovation Agency
Einsteinstrasse 2
CH-3003 Bern
+41 58 461 61 61 (Call Center)
info@innosuisse.ch
www.innosuisse.ch/
Contact person

 Dr.
Johann Michler
EMPA
Feuerwerkerstrasse 39
CH-3602 Thun
058 765 62 05
johann.michler@empa.ch