Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

• Forschungsstelle: INNOSUISSE
• Projektnummer: 7730.2;6 NMPP-NM
• Projekttitel Englisch: Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

Kurzbeschreibung (Englisch)

Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

Abstract (Englisch)

This technologically oriented research project aims at understanding and controlling the surface defect generation mechanisms governing the yield in multi-wire sawing of silicon wafers. The commercial goal is to develop a multi-wire-sawing process technology that allows mass production of thin crystalline silicon wafer (<100mm) suitable for solar cell production.