ModX: Development of Xray inspection solution for semiconductor Advanced Packaging

• Unité de recherche: INNOSUISSE
• Numéro de projet: 130.945 IP-ENG
• Titre du projet anglais: ModX: Development of Xray inspection solution for semiconductor Advanced Packaging

Mots-clé (Anglais)

Engineering, Semi-conductors

Résumé des résultats (Abstract) (Anglais)

Ismeca Semiconductor Europe S.A wants to develop an Xray inspection tool, in collaboration with the CSEM, to answer the Semiconductor advanced packages assembly market need for inner device body defects detection.