ModX: Development of Xray inspection solution for semiconductor Advanced Packaging

Research unit

INNOSUISSE

Project number

130.945 IP-ENG

Project title

ModX: Development of Xray inspection solution for semiconductor Advanced Packaging

Texts for this project

	German	French	Italian	English
Key words	-	-	-
Abstract	-	-	-

Category	Text
Key words (English)	Engineering, Semi-conductors
Abstract (English)	Ismeca Semiconductor Europe S.A wants to develop an Xray inspection tool, in collaboration with the CSEM, to answer the Semiconductor advanced packages assembly market need for inner device body defects detection.