DynamicMold in harsh environments: electronic packaging for high pressure and temperature

• Unité de recherche: INNOSUISSE
• Numéro de projet: 46714.1 IP-ENG
• Titre du projet anglais: DynamicMold in harsh environments: electronic packaging for high pressure and temperature

Description succincte (Allemand)

DynamicMold in harsh environments: electronic packaging for high pressure and temperature

Description succincte (Anglais)

DynamicMold in harsh environments: electronic packaging for high pressure and temperature

Résumé des résultats (Abstract) (Allemand)

Next-generation marking technology: matriq AG develops the intelligent DynamicMold inserts #DM-qode# for in-line and in-mold marking of injection-molded products. Harsh environments up to 2000 bar and 150 °C at heavy load cycles and high-power demand for robust miniaturized electronic packaging.