Research unit
Project number
46714.1 IP-ENG
Project title
DynamicMold in harsh environments: electronic packaging for high pressure and temperature
Project status Finished
Start date 01.07.2020
End date 01.01.2023
Granted total costs 619'773.70  CHF
Section 70 Engineering
Project category Project
Research type Applied research and development
NABS classification Industrial production and technology
Research disciplines
100 % T171 Microelectronics

Last modification of the project