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Research unit
INNOSUISSE
Project number
46714.1 IP-ENG
Project title
DynamicMold in harsh environments: electronic packaging for high pressure and temperature

Texts for this project
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Short description
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Short description
(German)
DynamicMold in harsh environments: electronic packaging for high pressure and temperature
Short description
(English)
DynamicMold in harsh environments: electronic packaging for high pressure and temperature
Abstract
(German)
Next-generation marking technology: matriq AG develops the intelligent DynamicMold inserts #DM-qode# for in-line and in-mold marking of injection-molded products. Harsh environments up to 2000 bar and 150 °C at heavy load cycles and high-power demand for robust miniaturized electronic packaging.