Customized through silicon via (TSV) interconnect technology: towards a gapless photon counting flat panel detector

Research unit

INNOSUISSE

Project number

33879.1 INNO-LS

Project title

Customized through silicon via (TSV) interconnect technology: towards a gapless photon counting flat panel detector

Texts for this project

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Abstract		-	-

Category	Text
Short description (German)	Customized through silicon via (TSV) interconnect technology: towards a gapless photon counting flat panel detector
Short description (English)
Abstract (German)
Abstract (English)