Conformal Layer Packaging for smart neurosurgical implants (CLP)

Fonte Standard Gras
Identifiant

Unité de recherche

INNOSUISSE

Numéro de projet

13207.1;6 PFLS-LS

Titre du projet

Conformal Layer Packaging for smart neurosurgical implants (CLP)

Titre du projet anglais

Conformal Layer Packaging for smart neurosurgical implants (CLP)

Textes relatifs à ce projet

	Allemand	Français	Italien	Anglais
Description succincte	-	-	-
Résumé des résultats (Abstract)	-	-	-

Textes saisis

Catégorie	Texte
Description succincte (Anglais)	Conformal Layer Packaging for smart neurosurgical implants (CLP)
Résumé des résultats (Abstract) (Anglais)	The main objective of the Conformal Layer Packaging project is the development of a novel thin film packaging that can be used to miniaturize intracranial flow- and pressure sensors to be integrated into hydrocephalus valves. The integration of multilayers coatings to implantable devices with complex surface structures requires a pinhole free conformal overgrowth of the implant surface. In order to reach this specification, a smoothing micro filler will be applied to the implant. Thereby the roughness of an implant is reduced in a way that the subsequently applied multilayer seals the implant hermetically. This packaging solution based on multilayer can be applied to any implantable device where miniaturization is the key.

Catégorie

Texte

Description succincte
(Anglais)

Conformal Layer Packaging for smart neurosurgical implants (CLP)

Résumé des résultats (Abstract)
(Anglais)

The main objective of the Conformal Layer Packaging project is the development of a novel thin film packaging that can be used to miniaturize intracranial flow- and pressure sensors to be integrated into hydrocephalus valves. The integration of multilayers coatings to implantable devices with complex surface structures requires a pinhole free conformal overgrowth of the implant surface. In order to reach this specification, a smoothing micro filler will be applied to the implant. Thereby the roughness of an implant is reduced in a way that the subsequently applied multilayer seals the implant hermetically. This packaging solution based on multilayer can be applied to any implantable device where miniaturization is the key.