Conformal Layer Packaging for smart neurosurgical implants (CLP)

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Research unit

INNOSUISSE

Project number

13207.1;6 PFLS-LS

Project title

Conformal Layer Packaging for smart neurosurgical implants (CLP)

Texts for this project

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Short description	-	-	-
Abstract	-	-	-

Inserted texts

Category	Text
Short description (English)	Conformal Layer Packaging for smart neurosurgical implants (CLP)
Abstract (English)	The main objective of the Conformal Layer Packaging project is the development of a novel thin film packaging that can be used to miniaturize intracranial flow- and pressure sensors to be integrated into hydrocephalus valves. The integration of multilayers coatings to implantable devices with complex surface structures requires a pinhole free conformal overgrowth of the implant surface. In order to reach this specification, a smoothing micro filler will be applied to the implant. Thereby the roughness of an implant is reduced in a way that the subsequently applied multilayer seals the implant hermetically. This packaging solution based on multilayer can be applied to any implantable device where miniaturization is the key.

Category

Text

Short description
(English)

Conformal Layer Packaging for smart neurosurgical implants (CLP)

Abstract
(English)

The main objective of the Conformal Layer Packaging project is the development of a novel thin film packaging that can be used to miniaturize intracranial flow- and pressure sensors to be integrated into hydrocephalus valves. The integration of multilayers coatings to implantable devices with complex surface structures requires a pinhole free conformal overgrowth of the implant surface. In order to reach this specification, a smoothing micro filler will be applied to the implant. Thereby the roughness of an implant is reduced in a way that the subsequently applied multilayer seals the implant hermetically. This packaging solution based on multilayer can be applied to any implantable device where miniaturization is the key.