Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

• Unité de recherche: INNOSUISSE
• Numéro de projet: 7730.2;6 NMPP-NM
• Titre du projet anglais: Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

Description succincte (Anglais)

Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

Résumé des résultats (Abstract) (Anglais)

This technologically oriented research project aims at understanding and controlling the surface defect generation mechanisms governing the yield in multi-wire sawing of silicon wafers. The commercial goal is to develop a multi-wire-sawing process technology that allows mass production of thin crystalline silicon wafer (<100mm) suitable for solar cell production.