Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

• Research unit: INNOSUISSE
• Project number: 7730.2;6 NMPP-NM

Short description (English)

Ultra thin silicon wafer cutting by multi-wire sawing - SIWIS

Abstract (English)

This technologically oriented research project aims at understanding and controlling the surface defect generation mechanisms governing the yield in multi-wire sawing of silicon wafers. The commercial goal is to develop a multi-wire-sawing process technology that allows mass production of thin crystalline silicon wafer (<100mm) suitable for solar cell production.