HIRONDELLE: High-resolution optical non-destructive evaluation for electro-optical leading-edge microsystems

• Research unit: EU RFP
• Project number: 00.0485

Key words (English)

Non-destructive testing; ESPI; optical strain evaluation; BGAs; flip-chip modules; Economic Aspects; Environmental Protection; Industrial Manufacture; Innovation; Technology Transfer; Safety

Alternative project number (English)

EU project number: G1RD-CT-2001-00521

Research programs (English)

EU-programme: 5. Frame Research Programme - 1.3.1 Innovative products, processes and organization

Short description (English)

See abstract

Further information (English)

Full name of research-institution/enterprise:
Eidg. Materialprüfungs- und Forschungsanstalt EMPA

Abteilung Elektronik/Messtechnik

Partners and International Organizations (English)

Ettemeyer AG (D), CWM GmbH (D), CRF ScpA (I), IXL-Uni. Bordeaux I (F), ASPI (F)

Abstract (English)

The ever-higher pace of miniaturisation of microelectronic systems asks for high-resolution non-destructive measurement techniques for in-process quality control, and optimisation of simulation tools to shorten design-to-product time. The proposal aims at the development of a laser optical sub-micrometer resolution deformation measurement tool for in-situ investigations of microsystems such as BGA, flip-chip, fibre- and micro-optic components as well as of lead-free solder bonds and material interfaces. For selected systems, thermo-mechanical FEM-models are developed and simulations are optimised and applied together with the measurement system to obtain realistic material and thermo-mechanical parameters. The findings will be disseminated through application reports and are a prerequisite for design and process optimisation and reliability analysis.

References in databases (English)

Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. [phone]
Swiss Project-Number: 00.0485