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Research unit
INNOSUISSE
Project number
13079.1 PFIW-IW
Project title
Fast cost optimized slicing process for silicon wafers by sawing with diamond coated wire
Project status Finished
 
Start date 01.06.2012
End date 01.01.2016
 
Granted total costs 628'000.00  CHF
Section 23 Förderbereich Engineering
Project category Project
Research type Applied research and development
NABS classification Industrial production and technology
 
Research disciplines
100 % T210 Mechanical engineering,hydraulics,vacuum techn.,vibration and acoustic eng.
Last modification of the project
27.11.2014