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Research unit
INNOSUISSE
Project number
7361.2;6 NMPP-NM
Project title
Microsensors for high-speed bonding of ultra-thin semiconductor chip.
Project status Finished
 
Start date 01.03.2005
End date 29.05.2007
 
Granted total costs 260'000.00  CHF
Section 22 Förderbereich Nano / Micro
Project category Project
Research type Applied research and development
NABS classification Non divisible / inclassable research
 
Research disciplines
100 % T171 Microelectronics
Last modification of the project
27.11.2014