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Research unit
INNOSUISSE
Project number
13079.1 PFIW-IW
Project title
Fast cost optimized slicing process for silicon wafers by sawing with diamond coated wire

Participants

Research organisation: Innosuisse
Swiss Innovation Agency
Einsteinstrasse 2
CH-3003 Bern
+41 58 461 61 61 (Call Center)
info@innosuisse.ch
www.innosuisse.ch/
Contact person

 Doktor
Friedrich Kuster
ETH Zürich
Tannenstrasse 3
CH-8092 Zürich
+41 44 632 24 24
kuster@iwf.mavt.ethz.ch

Implementation Partner

Alexander Beck
MB WAFERTEC
Allmendstrasse 86
CH-3600 Thun
+41 33 439 07 33
a.beck@meyerburger.ch