Reduction of street-width in chip-singulation by cutting to increase chip density

Forschungsstelle

INNOSUISSE

Projektnummer

5314.3;5 KTS-NM

Projekttitel

Reduction of street-width in chip-singulation by cutting to increase chip density

Zugehörige Projekte

Forschungsorganisation:	Schweizerische Agentur für Innovationsförderung
Projektnummer	6654.1;3 NMS-NM
Projekttitel	Micro jet perturbation reduction by etched high-pressure nozzles aiming reduction of street-width in chip-singulation by water-jet guided laser cutting