HAFAM: Handling and assembly of functionally adapted microcomponents

• Research unit: EU RFP
• Project number: 98.0038

Key words (English)

Microsystems; microfabrication; MEMS; microcomponents; micromechanics; assembly

Alternative project number (English)

EU project number: FMRXCT970141

Research programs (English)

EU-programme: 4. Frame Research Programme - 10.1 Stimulation of training and mobility

Short description (English)

See abstract

Partners and International Organizations (English)

TU Wien (A), Getehor (F), Forth (GR), IMM (D), Metacon (A),
MTE Messgeraete (A), SYNCTS (I), Uninova (P)

Abstract (English)

The goal of the project is to develop techniques for the assembly and handling of microparts. The problem of the micropart assembly can be understood from two different aspects. First it can be treated as a typical one-by-one assembly problem, i.e. microparts are handled and assembled individually with specially developed tools. Another approach is to assemble the microelements on a wafer level during the fabrication process, so that after the end of the processing the assembled system results. In the HAFAM network both approaches are addressed.
The IMT coordinates the activities related to the combining of different technologies in one fabrication process (Task 4), where the TU Wien (At), the IMM Mainz (De) and the Forth institute (Gr) collaborate. Silicon micromachining, electroplating and other microsystem technologies such as wafer bonding etc. are combined in one fabrication process to build functionally adapted microsystems.
During the first year of the HAFAM network a main objective was the study of the potentials and possibilities in microassemly offered by the combination of technologies. A detailed report (milestone A4) identifies three main areas where combining different technologies is of particular technological and commercial interest: 1) printing and display and other technologies based on array structures 2) Fibre optic systems and 3) high precision microparts as for microgrippers and mould inserts.
In the second year of the HAFAM network the realisation of generic demonstrators was the primary goal. Forth develops an Photonic Bandgap Material, which is an arrangement of many columns in an array. IFWT and IMM develop devices using a combination of micromachined parts with conventional parts, for applications in micro-injection moulding and micro-grippers. IMT develops an electrically adjustable fiber optic attenuator. First demonstrators were tested by Telecom companies such as Nortel/GB and Alcatel/F.
In the third year, IMT developed a 4x4 fibre optical switch matrix, based on the electrically adjustable fibre optic. First results will be published1. IMM did basic tests, which were carried out in 2000 to fill narrow structures, produced by dry etching of silicon, with electroplated metal and they plan to realize test narrow structures using LIGA and mount these structures with a precision robot.
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References in databases (English)

Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. [phone]
Swiss Project-Number: 98.0038