EUROPRACTICE II: Manufacturing Cluster 4

• Research unit: EU RFP
• Project number: 97.0035-1

Key words (English)

Microsystems

Alternative project number (English)

EU project number: 21101

Research programs (English)

EU-programme: 4. Frame Research Programme - 1.3 Telematic systems

Short description (English)

See abstract

Partners and International Organizations (English)

TMP (NL), HSA (NL) for cluster 4, 15 others in global project

Abstract (English)

The main objective of this project is to provide services allowing industry to incorporate microsystems more easily in their products. By promoting the application of microsystem technologies the industrial competitiveness can be improved substantially.
The following services are proposed by the cluster:
The consortium offers design, prototyping, manufacturing and testing services.
TMP will offer bulk and surface micromachining and support users with design, prototyping, packaging and test. TMP has special expertise in mechanical and fluidic microsystems. Application specific standard microsystems will be developed and will serve as basis of realising customised versions.
HSA will provide a range of complementary services for the design and production of hybrid assemblies, hybrid thin film substrates, packaging and testing.
CSEM offers a range of other bulk and surface micromachining technologies and support users with design, prototyping, and assembly and test services. CSEM has design experience in mechanical, magnetic, optical and biochemical microsystems and maintains the MPW service for diffractive optical elements introduced during EUROPRACTICE 1.
CSEM key results within the reporting period:
The DOE activity has lead to a range of custom products currently manufactured for application in microelectronics production equipment.
Application specific standard microsystems (ASSMs) have been developed and serve as basis of realising customised versions. CSEM has introduced three ASSMs, a new accelerometer family and a position sensor and a pressure sensing chip set.
The accelerometer family has become a standard product. It is distributed mainly in Europe and in USA. Its applications are in the areas of precision instrumentation, and navigation e.g. for compass correction. The Europractice effort lead to a customising project to adapt the accelerometer for a highly miniaturised compass module.
The Position sensor ASSM has obtained a large interest for the application in motor control. This Europractice ASSM development is presently under evaluation to become an independent commercial activity.
The technology for refractive optical Elements has been successfully transferred from the University of Neuchâtel and is demonstrated on 6' wafers. The 6' Europractice ROE activity has lead to a custom specific development program.
The services for assembly and test have been established and the silicon wafer fab is fully operational and four product lines are in regular production. It is also used for new product development designs done by customers (wafer fab service) or by CSEM design groups.
TMP and CSEM have continued their collaboration on process compatibility, thus allowing project transfers from one partner to the other.

References in databases (English)

Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. [phone]
Swiss Project-Number: 97.0035-1