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Unité de recherche
PCRD EU
Numéro de projet
96.0299
Titre du projet
RODCI: Reconfigurable optical devices for chip interconnects
Titre du projet anglais
RODCI: Reconfigurable optical devices for chip interconnects

Textes relatifs à ce projet

 AllemandFrançaisItalienAnglais
Mots-clé
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Programme de recherche
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Description succincte
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Partenaires et organisations internationales
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Résumé des résultats (Abstract)
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Références bases de données
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Textes saisis


CatégorieTexte
Mots-clé
(Anglais)
Optical interconnects; photonic technology; electronics

Autre Numéro de projet
(Anglais)
EU project number: EP 22.613
Programme de recherche
(Anglais)
EU-programme: 4. Frame Research Programme - 1.3 Telematic systems
Description succincte
(Anglais)
See abstract
Partenaires et organisations internationales
(Anglais)
Thomson CSF / LCR (F),
Commissariat à l'Energie Atomique (CEA-LETI) (F), Centre National de la Recherche Scientifique (CNRS/IOTA( (F), Electro-optics Industries ltd (ELOP) (Israel), Swiss federal institute of technology zurich (ETHZ) (CH), University College Cork (NMRC) (IRL),
University of Surrey (UK),
Ramot (Tel Aviv) University (Israel), University of Sheffield (UK)

Résumé des résultats (Abstract)
(Anglais)
The main objective of the RODCI-project is the development and evaluation of optoelectronic links for intra- and inter-chip communication. Towards this, the following key components have been developed:
Computer generated hologram optical plates, low threshold surface emitting lasers (VCSEL) for the generation and modulation of light, silicon and InGaAs photodetectors, transmitter and receiver electronics as well as especially suited micro-hybrid assembly techniques.
For a first prototype of multilevel optical hologram distribution of clock signals in and between IC-chips, ETH-Z has designed and delivered special high speed, low power-dissipation optical receiver and transmitter electronic integrated circuits. The receivers combined with specifically fabricated photodiodes of 70 micrometer in diameter are designed for clock speeds up to 300 MHz. Realized in a 0.8 micrometer CMOS technology, the front parts reach speeds up to 300 MHz. With interconnection circuits designed by another partner, they show full link functionality to 100 MHz or 200 Mbitls.
For surface emitter-laser (VCSEL) transmitters, drivers have been realized that are functioning up to 800 MHz.




Références bases de données
(Anglais)
Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. +41 31 322 74 82
Swiss Project-Number: 96.0299