ABEL: Automated back-end European Line

• Research unit: EU RFP
• Project number: 96.0107

Key words (German)

ESEC AUTOLINE; B-BEM Architektur; Adapter; Cellcontroller; Standardisierung; M-SS-Material Handling Superviser System

Alternative project number (English)

EU project number: EP 23.218

Research programs (English)

EU-programme: 4. Frame Research Programme - 1.3 Telematic systems

Short description (German)

Siehe Abstract

Partners and International Organizations (German)

SGS Thomson Agrate, SGS Thomson Grenoble, SGS Thomson Malta, FICO BV, Zevenaar (NL)

Abstract (German)

The Multi-Chip Module (MCM) technology will be made more attractive for use in communications, automotive, industrial and consumer electronics applications.
This will be realised by the development of a highly miniaturised and low overall cost MCM technology. It comprises innovative and low cost production processes at all levels- components, first level interconnect, substrates, second level interconnect- of the MCM architecture. The goals can be achieved through :

Components: Usage of flip chip with pitch down to 150 um or with redistributed pitch down to 250 um as well as Chip Scale or Chip Size Packages (CSP), peripheral pitch down to 200 um or grid array pitch down to 300 um.

First level interconnect: Mounting onto filled and tented vias. Reflow soldering for fine pitch flip chip, combined with underfill. Flip chip and SMD on flexible substrates combined using adhesive technology.

Substrates: Fine line multilayer substrates with lines and spacing down to 50 um, both in rigid and flex form with via in pad technology realised by photo imaging or laser drilling.

Second level interconnect: Interconnect to the outer world, through a moulded injection device ( MID).

References in databases (English)

Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. [phone]
Swiss Project-Number: 96.0107