AuroraPIC - Advanced electro-optical packaging and assembly of TFLN photonic integrated circuits

• Unité de recherche: INNOSUISSE
• Numéro de projet: 138.102 IP-ENG
• Titre du projet anglais: AuroraPIC - Advanced electro-optical packaging and assembly of TFLN photonic integrated circuits

Mots-clé (Anglais)

Engineering, Photonics

Résumé des résultats (Abstract) (Anglais)

The project envisions to disrupt the photonics industry by introducing new electro-optical packaging concepts for Lightium?s ultra-high speed TFLN modulators. The project results will be commercialized by Lightium and will be added to its commercial offerings through collaboration with SwissPIC.