AuroraPIC - Advanced electro-optical packaging and assembly of TFLN photonic integrated circuits

Research unit

INNOSUISSE

Project number

138.102 IP-ENG

Project title

AuroraPIC - Advanced electro-optical packaging and assembly of TFLN photonic integrated circuits

Texts for this project

	German	French	Italian	English
Key words	-	-	-
Abstract	-	-	-

Category	Text
Key words (English)	Engineering, Photonics
Abstract (English)	The project envisions to disrupt the photonics industry by introducing new electro-optical packaging concepts for Lightium?s ultra-high speed TFLN modulators. The project results will be commercialized by Lightium and will be added to its commercial offerings through collaboration with SwissPIC.