Ultra-Wide-Band and Energy-Efficient ASIC for the Next Generation AI Server Chip-to-Chip Links

• Unité de recherche: INNOSUISSE
• Numéro de projet: 131.678 IP-ENG
• Titre du projet anglais: Ultra-Wide-Band and Energy-Efficient ASIC for the Next Generation AI Server Chip-to-Chip Links

Mots-clé (Anglais)

Engineering, Semi-conductors

Résumé des résultats (Abstract) (Anglais)

A 1Tbps receiver will be prototyped for the chip-to-chip communication in a 3 nm CMOS. The chip achieves 3.5 times better efficiency than the state-of-the-art, paving the way for unprecedented in-package memory replaced by much cheaper on-board memory, thereby democratizing AI/ML processor systems.