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Research unit
INNOSUISSE
Project number
131.678 IP-ENG
Project title
Ultra-Wide-Band and Energy-Efficient ASIC for the Next Generation AI Server Chip-to-Chip Links

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CategoryText
Key words
(English)
Engineering, Semi-conductors
Abstract
(English)
A 1Tbps receiver will be prototyped for the chip-to-chip communication in a 3 nm CMOS. The chip achieves 3.5 times better efficiency than the state-of-the-art, paving the way for unprecedented in-package memory replaced by much cheaper on-board memory, thereby democratizing AI/ML processor systems.