Ultra-Wide-Band and Energy-Efficient ASIC for the Next Generation AI Server Chip-to-Chip Links

• Forschungsstelle: INNOSUISSE
• Projektnummer: 131.678 IP-ENG
• Projekttitel Englisch: Ultra-Wide-Band and Energy-Efficient ASIC for the Next Generation AI Server Chip-to-Chip Links

Schlüsselwörter (Englisch)

Engineering, Semi-conductors

Abstract (Englisch)

A 1Tbps receiver will be prototyped for the chip-to-chip communication in a 3 nm CMOS. The chip achieves 3.5 times better efficiency than the state-of-the-art, paving the way for unprecedented in-package memory replaced by much cheaper on-board memory, thereby democratizing AI/ML processor systems.