INGENIOUS - Universal TFLN-InP heterogeneous PIC platform

Research unit

INNOSUISSE

Project number

121.167 INT-ENG

Project title

INGENIOUS - Universal TFLN-InP heterogeneous PIC platform

Texts for this project

	German	French	Italian	English
Key words	-	-	-
Abstract	-	-	-

Category	Text
Key words (English)	Engineering, Photonics, Communication technologies
Abstract (English)	The INGENIOUS project seeks to create an advanced photonic integrated circuit (PIC) platform by integrating thin-film lithium niobate (TFLN) with indium phosphide (InP) lasers and detectors through micro-transfer printing (µTP), enabling a versatile and high-performance PIC solution.