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Research unit
INNOSUISSE
Project number
121.219 IP-ENG
Project title
ENHANCE: Wafer-scale micro-transfer printable thin film lithium niobate photonic integrated circuits

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CategoryText
Key words
(English)
Engineering, Photonics
Abstract
(English)
We will develop high-yield, wafer-scale processes to prepare TFLN PICs for micro-transfer printing (MTP) onto silicon photonic wafers. This will enhance optical data modulation and energy efficiency, meeting the demands of data centers, high-performance computing (HPC) for AI, and quantum computing.