ENHANCE: Wafer-scale micro-transfer printable thin film lithium niobate photonic integrated circuits

• Unité de recherche: INNOSUISSE
• Numéro de projet: 121.219 IP-ENG
• Titre du projet anglais: ENHANCE: Wafer-scale micro-transfer printable thin film lithium niobate photonic integrated circuits

Mots-clé (Anglais)

Engineering, Photonics

Résumé des résultats (Abstract) (Anglais)

We will develop high-yield, wafer-scale processes to prepare TFLN PICs for micro-transfer printing (MTP) onto silicon photonic wafers. This will enhance optical data modulation and energy efficiency, meeting the demands of data centers, high-performance computing (HPC) for AI, and quantum computing.