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Research unit
INNOSUISSE
Project number
123.634 IP-ENG
Project title
ETPS - Envelope Tracking Power Supply

Texts for this project
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Abstract
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Inserted texts


CategoryText
Key words
(English)
Engineering, Power electronics
Abstract
(English)
Aim of this project is to develop a new power supply able to adapt dynamically its DC link voltage. This power supply fits in a new high dynamics drive development suitable for the Hybrid bonding market, able to achieve settling precision down to the 50 nm.