On-wafer microwave metrology for future industrial applications

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Unité de recherche

SEFRI

Numéro de projet

24.00295

Titre du projet

On-wafer microwave metrology for future industrial applications

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	Allemand	Français	Italien	Anglais
Résumé des résultats (Abstract)	-	-	-

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Catégorie	Texte
Résumé des résultats (Abstract) (Anglais)	Semiconductor chips are used in many established and emerging applications, e. g. , 6G telecommunications, automotive radar sensors, space-deployed radiometers for earth monitoring, and wearable electronics for healthcare. However, there is currently a lack of traceable measurement techniques for millimetre-wave and terahertz (THz) planar integrated circuits (ICs), particularly those based on compound semiconductors. Thus, in order to strengthen the European semiconductor industry and facilitate the development of next-generation semiconductor technologies, new accurate and traceable on-wafer measurement techniques are needed together with best practice guides for on-wafer measurement. In addition, improved methods are needed for the characterisation of compound transistors above 110 GHz, and for novel 2D, thin film and semiconductor materials.

Catégorie

Texte

Résumé des résultats (Abstract)
(Anglais)

Semiconductor chips are used in many established and emerging applications, e. g. , 6G telecommunications, automotive radar sensors, space-deployed radiometers for earth monitoring, and wearable electronics for healthcare. However, there is currently a lack of traceable measurement techniques for millimetre-wave and terahertz (THz) planar integrated circuits (ICs), particularly those based on compound semiconductors. Thus, in order to strengthen the European semiconductor industry and facilitate the development of next-generation semiconductor technologies, new accurate and traceable on-wafer measurement techniques are needed together with best practice guides for on-wafer measurement. In addition, improved methods are needed for the characterisation of compound transistors above 110 GHz, and for novel 2D, thin film and semiconductor materials.