On-wafer microwave metrology for future industrial applications

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SBFI

Projektnummer

24.00295

Projekttitel

On-wafer microwave metrology for future industrial applications

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	Deutsch	Französisch	Italienisch	Englisch
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Abstract (Englisch)	Semiconductor chips are used in many established and emerging applications, e. g. , 6G telecommunications, automotive radar sensors, space-deployed radiometers for earth monitoring, and wearable electronics for healthcare. However, there is currently a lack of traceable measurement techniques for millimetre-wave and terahertz (THz) planar integrated circuits (ICs), particularly those based on compound semiconductors. Thus, in order to strengthen the European semiconductor industry and facilitate the development of next-generation semiconductor technologies, new accurate and traceable on-wafer measurement techniques are needed together with best practice guides for on-wafer measurement. In addition, improved methods are needed for the characterisation of compound transistors above 110 GHz, and for novel 2D, thin film and semiconductor materials.

Kategorie

Text

Abstract
(Englisch)

Semiconductor chips are used in many established and emerging applications, e. g. , 6G telecommunications, automotive radar sensors, space-deployed radiometers for earth monitoring, and wearable electronics for healthcare. However, there is currently a lack of traceable measurement techniques for millimetre-wave and terahertz (THz) planar integrated circuits (ICs), particularly those based on compound semiconductors. Thus, in order to strengthen the European semiconductor industry and facilitate the development of next-generation semiconductor technologies, new accurate and traceable on-wafer measurement techniques are needed together with best practice guides for on-wafer measurement. In addition, improved methods are needed for the characterisation of compound transistors above 110 GHz, and for novel 2D, thin film and semiconductor materials.