Joinful-alternative JOINing for next generation hermetic and corrosion-resistant CDGs for high performance fabs

• Unité de recherche: INNOSUISSE
• Numéro de projet: 102.738 IP-ENG
• Titre du projet anglais: Joinful-alternative JOINing for next generation hermetic and corrosion-resistant CDGs for high performance fabs

Mots-clé (Anglais)

Engineering, Material sciences

Résumé des résultats (Abstract) (Anglais)

Semiconductor fabrication demands reliable high accuracy vacuum sensors to work in the most chemically aggressive environments. To meet the continuously increasing demands, our goal is to develop a new sensor with robust corrosion-resistant hermetic joints through new joining materials & processes.