Joinful-alternative JOINing for next generation hermatic and corrosion-resistant CDGs for high performance fabs

Research unit

INNOSUISSE

Project number

102.738 IP-ENG

Project title

Joinful-alternative JOINing for next generation hermetic and corrosion-resistant CDGs for high performance fabs

Texts for this project

	German	French	Italian	English
Key words	-	-	-
Abstract	-	-	-

Category	Text
Key words (English)	Engineering, Material sciences
Abstract (English)	Semiconductor fabrication demands reliable high accuracy vacuum sensors to work in the most chemically aggressive environments. To meet the continuously increasing demands, our goal is to develop a new sensor with robust corrosion-resistant hermetic joints through new joining materials & processes.