Joinful-alternative JOINing for next generation hermetic and corrosion-resistant CDGs for high performance fabs

• Forschungsstelle: INNOSUISSE
• Projektnummer: 102.738 IP-ENG
• Projekttitel Englisch: Joinful-alternative JOINing for next generation hermetic and corrosion-resistant CDGs for high performance fabs

Schlüsselwörter (Englisch)

Engineering, Material sciences

Abstract (Englisch)

Semiconductor fabrication demands reliable high accuracy vacuum sensors to work in the most chemically aggressive environments. To meet the continuously increasing demands, our goal is to develop a new sensor with robust corrosion-resistant hermetic joints through new joining materials & processes.