Pushing the Limits of the NanoFrazor Technology: From Processes and Materials to Upscaling - Texts

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Research unit

INNOSUISSE

Project number

62122.1 IP-ENG

Project title

Pushing the Limits of the NanoFrazor Technology: From Processes and Materials to Upscaling (Innolink: 100.062 IP-ENG)

Texts for this project

	German	French	Italian	English
Short description		-	-
Abstract		-	-	-

Inserted texts

Category	Text
Short description (German)	Pushing the Limits of the NanoFrazor Technology: From Processes and Materials to Upscaling (Innolink: 100.062 IP-ENG)
Short description (English)	Pushing the Limits of the NanoFrazor Technology: From Processes and Materials to Upscaling
Abstract (German)	Thermal scanning probe lithography (tSPL) is becoming more important in the nanolithography community. To go to the next level, upscaling of the NanoFrazor technology and processes to larger areas, operating with inert environments, and increasing throughput via parallelization needs to be realized.