Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability

• Unité de recherche: INNOSUISSE
• Numéro de projet: 50347.1 IP-ENG
• Titre du projet anglais: Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability

Description succincte (Allemand)

Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability

Description succincte (Anglais)

Development of methods for the prediction of failure of bonded layers in electronic components in order to improve their quality reliability

Résumé des résultats (Abstract) (Allemand)

Develop experimental and numerical methods to predict fracture behavior of adhesively bonded layers in small electronic components, to improve quality and reliability. This will lead to better products at lower costs by emphasizing specific FEA predictions over general design rules.