Development of methods for the prediction of failure of bonded layers in electronic components in order to improve their quality reliability - Texts

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Research unit

INNOSUISSE

Project number

50347.1 IP-ENG

Project title

Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability

Texts for this project

	German	French	Italian	English
Short description		-	-
Abstract		-	-	-

Inserted texts

Category	Text
Short description (German)	Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability
Short description (English)	Development of methods for the prediction of failure of bonded layers in electronic components in order to improve their quality reliability
Abstract (German)	Develop experimental and numerical methods to predict fracture behavior of adhesively bonded layers in small electronic components, to improve quality and reliability. This will lead to better products at lower costs by emphasizing specific FEA predictions over general design rules.