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Forschungsstelle
INNOSUISSE
Projektnummer
50347.1 IP-ENG
Projekttitel
Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability
Projekttitel Englisch
Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability

Texte zu diesem Projekt
 DeutschFranzösischItalienischEnglisch
Kurzbeschreibung
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Abstract
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Erfasste Texte


KategorieText
Kurzbeschreibung
(Deutsch)
Development of methods for the prediction of failure of bonded layers in electronic components in order to improve quality and reliability
Kurzbeschreibung
(Englisch)
Development of methods for the prediction of failure of bonded layers in electronic components in order to improve their quality reliability
Abstract
(Deutsch)
Develop experimental and numerical methods to predict fracture behavior of adhesively bonded layers in small electronic components, to improve quality and reliability. This will lead to better products at lower costs by emphasizing specific FEA predictions over general design rules.