Integrated Highly Dynamic Position Sensor with Package Stress Compensation

• Unité de recherche: INNOSUISSE
• Numéro de projet: 49411.1 IP-ENG
• Titre du projet anglais: Integrated Highly Dynamic Position Sensor with Package Stress Compensation

Description succincte (Allemand)

Integrated Highly Dynamic Position Sensor with Package Stress Compensation

Description succincte (Anglais)

Integrated Highly Dynamic Position Sensor with Package Stress Compensation

Résumé des résultats (Abstract) (Allemand)

In this project we push forward modern position sensing based on a principle developed in Switzerland. These devices are produced by millions today as microchip for consumer electronics. The goal is to increase their performance to serve the field of robotics and efficient motion control.