Integrated Highly Dynamic Position Sensor with Package Stress Compensation

Research unit

INNOSUISSE

Project number

49411.1 IP-ENG

Project title

Integrated Highly Dynamic Position Sensor with Package Stress Compensation

Texts for this project

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Short description		-	-
Abstract		-	-	-

Category	Text
Short description (German)	Integrated Highly Dynamic Position Sensor with Package Stress Compensation
Short description (English)	Integrated Highly Dynamic Position Sensor with Package Stress Compensation
Abstract (German)	In this project we push forward modern position sensing based on a principle developed in Switzerland. These devices are produced by millions today as microchip for consumer electronics. The goal is to increase their performance to serve the field of robotics and efficient motion control.