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Research unit
INNOSUISSE
Project number
49411.1 IP-ENG
Project title
Integrated Highly Dynamic Position Sensor with Package Stress Compensation

Texts for this project

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Short description
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Abstract
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CategoryText
Short description
(German)
Integrated Highly Dynamic Position Sensor with Package Stress Compensation
Short description
(English)
Integrated Highly Dynamic Position Sensor with Package Stress Compensation
Abstract
(German)
In this project we push forward modern position sensing based on a principle developed in Switzerland. These devices are produced by millions today as microchip for consumer electronics. The goal is to increase their performance to serve the field of robotics and efficient motion control.
Abstract
(English)