High speed, reflection free, micrometer resolution, multi source 3D image acquisition system for 3D automatic optical inspection (AOI) of electronic boards - Texts

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Research unit

INNOSUISSE

Project number

41956.1 IP-ENG

Project title

High speed, reflection free, micrometer resolution, multi source 3D image acquisition system for 3D automatic optical inspection (AOI) of electronic boards

Texts for this project

	German	French	Italian	English
Short description		-	-
Abstract		-	-	-

Inserted texts

Category	Text
Short description (German)	High speed, reflection free, micrometer resolution, multi source 3D image acquisition system for 3D automatic optical inspection (AOI) of electronic boards
Short description (English)	High speed, reflection free, micrometer resolution, multi source 3D image acquisition system for 3D automatic optical inspection (AOI) of electronic boards
Abstract (German)	Current optical inspection systems require several ad-hoc machines to correctly detect errors.The goal is developing an innovative optical inspection head, which enables a single system to address all quality control needs.This will extremely improve efficiency and flexibility in production lines.